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Electronics Assembly service
β¬0.01
Hitech can provide a full turnkey solution to all of your electronics assembly requirements. From pcb assembly to full box build we can provide a full ems solution to your electronics manufacturing requirements. If you want to work with a reliable electronics manufacturer please get in touch with us.
Technical Parameters
Electronics Assembly service
Product type: 6 Layers Board
Material: Fr4 S1000-2 TG170
Application filed: Electronics Equipment
Layer/thickness: 6L/1.6mm
Surface treatment: ENIG
Line space/width: 0.10/0.10mm
Minimum hole size: 0.25mm
Technical Feature: Fine line, impedance control
Components: As Bom list
Technical Parameters
Electronics Assembly service
Product type: 6 Layers Board
Material: Fr4 S1000-2 TG170
Application filed: Electronics Equipment
Layer/thickness: 6L/1.6mm
Surface treatment: ENIG
Line space/width: 0.10/0.10mm
Minimum hole size: 0.25mm
Technical Feature: Fine line, impedance control
Components: As Bom list
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