6 layer high density pcb for intercon with immersion gold finishing on top and bottom, HDI pcb composed of FR-4 Tg150 halogen free. The thickness of finished board and the copper are 1.0mm and 12um. When higher density components are required, microvias are used instead of vias, and vias are used to improve wiring skill, thus, high density printed circuit board technology is the best choice.

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